It is made of glass fiber cloth as reinforcing material, impregnated with resin, covered with copper foil, and made by high temperature and hot pressing. It is a product with the largest amount of electronic circuit boards, referred to as FR-4. Due to the rapid development of electronic products, the requirements for copper-clad laminates have increased, and different FR-4 materials have been derived, such as lead-free substrates and high-speed high-frequency boards. This type of sheet has both single and double-sided copper cladding.
- Excellent dimensional stability
- Excellent heat resistance and mechanical properties
- IPC 4101 D /21 specification is applicable
- Copper thickness: 18um
- PCB thickness: 1.6mm
FR4-Single Fiber Layer size 1.00×0.60 m2 (1/0).
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